Why semiconductor coating yield is limited by invisible pollution? Ultra-high purity Mo2 molybdenum plate is the key solution.

Mo2 molybdenum plate solves this problem from the root. Its chemical composition, Mo is ≥ 99. 95%, the impurity content is strictly controlled at an extremely low level, and the vapor pressure under vacuum is almost negligible. That is to say, even if the furnace temperature is washed above 1800 °C, it will not "secretly poison" like other materials, ensuring that the entire coating cavity is clean to the laboratory level.

Take a customer we serve that makes photovoltaic thin films and integrated circuits as an example. In the past, they used ordinary heat-resistant plates as sputtering target substrates, and 8-12% of the film layer in each batch was wasted due to particle pollution. After replacing it with our Mo2 molybdenum plate, after running for three consecutive months, the density of polluting particles directly dropped to 1/5 of the original, and the yield rate steadily increased by 11%. What's even more exaggerated is that the utilization rate of the target is also high, because the substrate itself does not release gas, the sputtering process is more stable, and the single coating time can be shortened by 7%. After one year, the cost saved by scrapped sheets alone far exceeds the investment in molybdenum plates themselves.

Why does high purity bring such a big gap? Semiconductor coatings have extremely high requirements on atomic purity, and any impurities of the order of 10 √ may cause short circuits, leakage, or optical performance degradation. Mo2 molybdenum plate is not only pure, but also has extremely low vapor pressure at high temperature. With our controllable thickness tolerance (from ± 0.05 mm) and flatness (≤ 0.5 mm/m), after processing into ion source components or target substrates, the installation accuracy is high, the thermal field is uniform, and the equipment hardly needs to stop to clean the cavity.

Of course, high purity is only one of the "killer features" of Mo2 molybdenum plates in the semiconductor field. Its melting point is 2623 °C, and it can still have high strength at 2000 °C, and its thermal coefficient is as low as 5 × 10 → →/°C, so that the structural parts in the hot zone will not be deformed for a long time. According to feedback from many equipment manufacturers, after replacing the Mo2 molybdenum plate, the furnace maintenance cycle has been extended from the original 3 months to 8-10 months, and the operating rate has directly increased to a higher level.

Mo2 molybdenum plates with a thickness of 0.5 mm to 50mm in our warehouse are stocked all year round, and the surface can be cold-rolled bright (suitable for precision machining) or hot-rolled black (better oxidation resistance). The minimum order is only 10kg. Take the model and go back to install it for testing. After running one or two furnaces, you will know the difference. Diameter, tolerance, size, and even custom processing according to drawings are supported, and OEM OEM is no problem.

If you are still troubled by the old problems of invisible pollution of semiconductor coating, yield fluctuations, or equipment maintenance, you might as well turn your attention to "material purity", which is the most easily overlooked but deadliest point. The Mo2 molybdenum plate is not simply replaced with a plate, but directly raises the stability of the entire film process to a higher level.

Need us to customize the Mo2 molybdenum substrate according to your coating equipment drawing? Or send 10kg samples first for you to verify on site? Feel free to contact us. Fast delivery in small batches, test first, and then buy, zero risk. The semiconductor equipment factories that have really used it understand that in high-end film manufacturing, choosing the right "zero-pollution" molybdenum plate is often the last step to completely stabilize the yield and profit.