Tantalum Nozzle

In the precision chemical industry and semiconductor cleaning process, the nozzle is often the most severely damaged part of the whole system. Due to the need to withstand the double test of high-speed fluid erosion and strong acid corrosion, ordinary materials often have reaming, drift and even failure within a few days. Tantalum nozzles, with their near-"platinum" chemical inert and superior scour resistance, are becoming an indispensable corrosion-resistant core component in high-value production lines.

1. Basic performance: peak performance of chemical bluntness Tantalum (Ta), as the "king of corrosion protection" among refractory metals, endows the nozzle with a unique physical soul:

Absolute neutrality of acidity: The corrosion rate of tantalum nozzles is almost zero in concentrated sulfuric acid, hydrochloric acid and king water below 200 °C.

Micron-scale aperture stability: The extremely high elastic modulus ensures that the aperture size and shape of the nozzle are consistent under the impact of high-speed fluid, maintaining a precise spray angle.

Extreme biocompatibility: Without any catalytic or polluting effect on the reaction medium, it is a choice for the production of pharmaceutical and electronic grade chemicals.

2. Chemical composition and technical indicators

We use high-purity electron beam melting (EBM) ingots to ensure the purity and uniformity of the material at the micro level.

Element	Ta (%)	Nb (ppm)	Fe (ppm)	O (ppm)	N (ppm)	C (ppm)
High Purity	≥ 99.95	≤ 500	≤ 50	≤ 100	≤ 30	≤ 30
Super-High Purity	≥99.99	≤ 50	≤ 10	≤ 50	≤ 10	≤ 10

Standard: ASTM B365 (Tantalum and Tantalum Alloy Bar and Wire) or customized according to customer engineering drawings.

3. Lean process: from dense ingots to miniature nozzles

The processing of tantalum is extremely challenging, and our process ensures mirror-level performance of the nozzle:

Precision forging and annealing: Refine the grain structure, eliminate the internal stress of processing, and prevent micro-cracks under high pressure conditions.

Micro-hole machining technology: Using high-precision laser drilling or slow-moving wire electric discharge machining (EDM), micro-holes with diameters as low as 0.05 mm can be realized.

Inner runner grinding: The unique runner polishing process greatly increases the fluid resistance and prevents solute from scaling or precipitation inside the nozzle.

4. Product specifications and basic parameters

Types: Solid cone, fan, atomized, fan nozzle or custom shaped structure.

Aperture range: 0.05 mm-10.0 mm.

Connection: Threaded connection (NPT/G/PT), flanged connection or fast plug-in design.

Rated pressure: Withstands instantaneous pressure of up to 200 bar +.

5. Surface treatment: the ultimate fusion of cleanliness and finish

Electrochemical polishing: Eliminate microscopic burrs on the surface, so that the nozzle can achieve a mirror effect (Ra ≤ e 0.2 um).

Passivation treatment: Further strengthen the oxidation protective film on the surface to improve the adaptability under initial use.

Ultrasonic cleaning: Complete cleaning in the 10,000-level clean room to ensure that there is no residual cutting oil or metal particles.

6. Core advantage: Why do senior process engineers choose our tantalum nozzles?

Long life, low shutdown rate: Under the same strong acid working condition, the service life of tantalum nozzle is 5-8 times that of Hastelloy or Zirconium.

Perfect spray consistency: Excellent wear resistance ensures that the nozzle will not ream under flushing, ensuring the stability of spray coverage and atomized particle size.

Return on Investment (ROI): Although the unit price is relatively high, the expensive production line shutdown maintenance costs have significantly increased the overall operating costs.

7. Application fields: covering the most stringent fluid scenarios

Semiconductor manufacturing: high-purity acid spraying in wafer cleaning equipment (Wet Bench).

Pharmaceutical industry: Catalyst injection or reactant addition in the synthesis of corrosive intermediates.

Fine chemical industry: acid pickling and spray drying process under concentrated sulfuric acid and dilute sulfuric acid. Fluid control elements for high temperature acid testing.