Tantalum Spun Funnels

    In cutting-edge processes such as semiconductor vapor phase Epitaxy (Epitaxy), high-temperature Ion Implantation (Ion Implantation), and ultra-high vacuum fluid control, the uniformity of flow channel gas flow and the reflection efficiency of thermal radiation are crucial. In the face of this kind of tapered Conical or double funnel structure, not only the material loss is great, but also the weld seam in the internal flow channel is very easy to disturb the Laminar Flow (Laminar Flow), and cause local thermal stress concentration.

    In 2026, we will launch a new generation of Custom Precision Spun Tantalum Components. The product uses 99.95% electronic-grade high-purity tantalum plate as the base material, and is formed in one stop by advanced CNC Power Spinning process, which perfectly takes into account the consistency of the gradient curve and the extremely high wall thickness.

I. Core Technology Advantages (Elite Engineering Advantages)

    Seamless Streaming Profiles and Zero Friction (Seamless Streaming Profiles For example, the concave arc surface of the mirror (good reflectivity) can provide excellent aerodynamic performance and extremely low particle accumulation rate when used as a gas deflector or thermal radiation screen.

    Isotropic Grain Structure & Thermal Shock Resistance: Tantalum is prone to work hardening during cold spinning. Through the alternating technology of "multi-pass lightweight deformation and intermediate ultra-high vacuum annealing (UHV Annealing)", we effectively eliminate the residual deformation shear stress, so that the molded parts have excellent toughness, and will never creep cracking or warping under thermal shock above 1500 °C.

    High-precision assembly welding (CNC Spot Welding): As shown in the figure, the spinning part is precisely assembled and welded with a four-jaw ring support frame. We adopt a special spot welding technology with micro-zone energy control to achieve fusion while compressing the welding heat affected zone (HAZ) to micron level, completely eliminating recrystallization and embrittlement caused by local heating.

III. Strict chemical composition control (Chemical Profile Weight%)

In order to prevent grain boundary slip fracture caused by microscopic impurities during spinning deformation, we have implemented hard core restrictions on gaseous elements that play a key role in tensile strength:

Ta (major element purity): ≥ 99. 95%

O (oxygen): ≤ 0. 015% N (nitrogen): ≤ 0. 010% H (hydrogen): ≤ 0. 0015%

C (carbon): ≤ 0. 010% Fe (iron): ≤ 0. 010% Nb (niobium impurity): ≤ 0. 050%

IV. Advanced Processing Flow

Wafer blanking and microscopic flaw detection: CNC wafer cutting is carried out with ASTM B708 high-purity sheet, and 100% surface eddy current detection is performed to ensure that there are no macroscopic delamination defects.

Multi-pass cold spinning (Metal Spinning): On a special CNC spinning machine, a special wear-resistant alloy rotor is used to catch up with the press layer by layer to adjust the deformation rate.

High vacuum supercrystalline annealing: annealing at a vacuum of 10-4Pa at approximately 1100 °C to re-equiaxed the grains and eliminate hardening, followed by the next subfine spin.

Combination of internal support parts and micro-beam spot welding: laser precision machining of the inner lining grille or ring parts, in-situ fixture fastening and low-heat input welding.

Chemical polishing and ultrasonic ultra-clean clean packaging (semiconductor grade delivery standard).

V. Cross-border cutting-edge applications (High-Value Applications)

Epitaxy Gas Inlets (Epitaxy Gas Inlets): In the MOCVD or high-temperature CVD cavity, it acts as a spray collector, guide cone or venturi throat for high-temperature corrosive gases.

Beam Line Components (Beam Line Components): In high-energy semiconductor ion implanters, they serve as high-temperature radiation protection cones to block high-energy electron/ion beam bombardment.

Radiation Shields for high-vacuum high-temperature furnaces: core observation hole heat insulation sleeves or vacuum line heat overflow blocking devices for ultra-high-vacuum furnaces in laboratories.