Chromium Bonding Target

1. Product core structure: bimetallic synergy

    Sputtering surface: high-purity chromium (Cr), providing a dense, wear-resistant and excellent adhesion metal film.

    Backplane: High-quality oxygen-free copper (C10200), using its excellent thermal conductivity, quickly takes away the high temperature generated during sputtering.

    Binding layer: high-purity indium (In) metal welding is used to effectively relieve the thermal stress between heterogeneous materials and ensure a binding rate of more than 98%.

2. Technical Standards and Chemical Composition (Superior Purity)

    We strictly control the gas impurity content in the chromium metal to ensure the plasma stability during sputtering.

3. Lean process: look at the quality from the details of the picture

    U-shaped deep cooling tank: Observe the back of the picture, the precise CNC machined flow channel design maximizes the area between the cooling water and the copper backplane, and can prevent indium solder from melting even under high-power continuous operation.

    Precise dovetail countersunk hole: The design of the porous position ensures the absolute stability of the target in the vacuum chamber, and the force is uniform, avoiding deformation caused by thermal expansion and contraction.

    Vacuum indium welding process: The entire binding process is completed in the vacuum furnace to ensure that the interface is free of bubbles and oxidation, and the thermal resistance is minimized.

4. Surface treatment: cleanliness determines film formation

    Sputtering surface: After fine grinding, the surface finish can reach Ra0.8 um, shortening the arcing time.

    Side and back: Passivation treatment or ultrasonic cleaning is used to thoroughly remove processing residues and ensure the background vacuum of the vacuum chamber.

5. Basic parameters and Specifications (Specifications)

    Length range: Customizable to 2000mm (long strip target as shown in the picture).

    Total thickness: Typical configuration is 6mm (Cr) + 8mm (Cu).

Binding rate detection: Standard ultrasonic flaw detection (C-Scan) report.

    Tolerance control: length/width ± 0.5 mm, flatness ≤ 0.1 mm.

6. Core advantage: Why choose our binding solution?

    Excellent cracking resistance: Pure chromium targets are brittle and easy to break when used directly. Our binding technology greatly prolongs the service life of the target through the buffer of the indium layer.

    Higher power load: The enhanced cooling channel design supports higher target power density, improving your production output ratio.

    Out of the box: 100% vacuum packaging, no burr treatment on the edge, greatly increasing the risk of contamination during installation.

7. Application fields: the miracle of driving vision and protection

Flat Panel Display (FPD): fabrication of gate/source leads and masks for TFT-LCD arrays.

    Decorative coating: Provide high-brightness, wear-resistant metallic chrome appearance layer for bathroom, watch and consumer electronics.

    Physical vapor deposition (PVD): As the bottom layer of the special alloy film layer, it strengthens the adhesion of the film base.